On Properties of Boundaries and Electron Conductivity in Mesoscopic Polycrystalline Silicon Films for Memory Devices

نویسندگان

  • G. P. Berman
  • G. D. Doolen
  • R. Mainieri
  • J. Rehacek
  • K. E. Nagaev
چکیده

We present the results of molecular dynamics modeling on the structural properties of grain boundaries (GB) in thin polycrystalline films. The transition from crystalline boundaries with low mismatch angle to amorphous boundaries is investigated. It is shown that the structures of the GBs satisfy a thermodynamical criterion suggested in [9]. The potential energy of silicon atoms is closely related with a geometrical quantity – tetragonality of their coordination with their nearest neighbors. A crossover of the length of localization is observed. To analyze the crossover of the length of localization of the single-electron states and properties of conductance of the thin polycrystalline film at low temperature, we use a two-dimensional Anderson localization model, with the random one-site electron charging energy for a single grain (dot), random non-diagonal matrix elements, and random number of connections between the neighboring grains. The results on the crossover behavior of localization length of the single-electron states and characteristic properties of conductance are presented in the region of parameters where the transition from an insulator to a conductor regimes takes place.

برای دانلود رایگان متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Cross-Plane Phonon Conduction in Polycrystalline Silicon Films

Silicon films of submicrometer thickness play a central role in many advanced technologies for computation and energy conversion. Numerous thermal conductivity data for silicon films are available in the literature, but they are mainly for the lateral, or in-plane, direction for both polycrystalline and single crystalline films. Here, we use time-domain thermoreflectance (TDTR), transmission el...

متن کامل

Effect of Thickness on Structural and Morphological Properties of AlN Films Prepared Using Single Ion Beam Sputtering

Aluminum nitride (AlN) thin films have potential applications in microelectronic and optoelectronic devices. In this study, AlN thin films with different thicknesses were deposited on silicon substrate by single ion beam sputtering method. The X-ray diffraction (XRD) spectra revealed that the structure of films with thickness of - nm was amorphous, while the polycrystalline hexagonal AlN with a...

متن کامل

Temperature-Dependent Thermal Conductivity of Undoped Polycrystalline Silicon Layers

Polycrystalline silicon is used in microelectronic and microelectromechanical devices for which thermal design is important. This work measures the in-plane thermal conductivities of free-standing undoped polycrystalline layers between 20 and 300 K. The layers have a thickness of 1 +m, and the measurements are performed using steady-state Joule heating and electrical-resistance thermometry in p...

متن کامل

Preparation and Characterization of Aluminum Nitride Thin Films with the Potential Application in Electro-Acoustic Devices

In this work, aluminum nitride (AlN) thin films with different thicknesses were deposited on quartz and  silicon  substrates  using  single  ion  beam  sputtering  technique.  The  physical  and  chemical properties  of  prepared  films  were  investigated  by  different  characterization  technique.  X-ray diffraction (XRD) spectra revealed that all of the deposited films have an amorphous str...

متن کامل

Enhanced in-plane thermoelectric figure of merit in p-type SiGe thin films by nanograin boundaries.

P-Type polycrystalline silicon-germanium (SiGe) thin films are grown by low-pressure chemical vapor deposition (LPCVD) and their thermoelectric properties are characterized from 120 K to 300 K for potential application in integrated microscale cooling. The naturally formed grain boundaries are found to play a crucial role in determining both the charge and thermal transport properties of the fi...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 1998